My first column on EEJournal, The Artificial Intelligence Apocalypse (Part 1), was posted on September 19, 2019. That’s almost seven years ago as I pen these words. Things are moving so fast these days that I find it hard to wrap my brain around how much the technology landscape has changed since those far-off times.
Take AI, for example. If, seven years ago, I’d predicted the advances in AI we now take for granted—including generative AI, agentic AI, edge AI, and physical AI—you’d have laughed your socks off. Saying this reminds me of the English Comedian, Bob Monkhouse, who famously observed, “People used to laugh at me when I said I wanted to be a comedian. Well, they’re not laughing now.” But we digress.
At that time, I was writing four columns a month for this august publication. Somewhere along the way, this increased to six columns a month. Now, it’s two columns a week, which equates to more than 100 columns a year.
I breezed through my first 100 columns without thinking, which is a good description of my usual modus operandi, now that I come to think about it. In fact, it wasn’t until I was about ten columns past the milestone that it suddenly occurred to me that I probably ought to commemorate it. So, better late than never (which is a good contender for the epitaph on my gravestone), I assembled a list of my first hundred columns, complete with one-line descriptions and links to each one (see Eeek! 100 Captivating Columns and Counting).
Since then, I’ve repeated the exercise every hundred columns, with Yet Another 100 Captivating Columns and Counting! at the 200 mark, O-M-G! 100 More Captivating Columns celebrating number 300, and WTW (“What the What”)? Another 100 Mindboggling Columns! as we sailed past the 400 milestone.
All of which brings us to today and the rather alarming realization that this is column number 500. With my columns averaging around 1,500 words each, that’s roughly three-quarters of a million words, and I haven’t even warmed up yet!
When I look back at the 100 columns below, which are presented in chronological order for your delectation and delight, I’m struck by the astonishing breadth and pace of technological innovation. It also leaves me wondering what marvels I’ll be writing about over the next hundred columns.
I’ll tell you what—let’s reconvene in another 100 columns’ time and compare notes. In the meantime, feast your orbs on the list below. I’d love to hear which columns were your favorites (and why), which introduced you to something new, and which lured you down an unexpected rabbit hole. Please let me know in the comments at the end of the column.
Simulating Antenna(s) to Bits and Back in Wireless Communication and Radar Systems
MathWorks provides tools to simulate every aspect of a wireless communication system or radar system, from the antenna(s) to digital bits and back again.
Is AI Poised to Run Amok (Part 1)?
Like so many other things, the problem with AI is that it’s a double-edged sword.
https://www.eejournal.com/article/is-ai-poised-to-run-amok-part-1/
An Awesome Addition to the Power Supply Market
The folks at XP Power say it’s time to “up the game” in power supply space (where no one can hear you scream).
https://www.eejournal.com/article/an-awesome-addition-to-the-power-supply-market/
Powering the Ambient IoT with Over-the-Air Wireless Power Networks
The folks at Energous are leaders in RF-based, over-the-air (OTA) wireless power technology for the Ambient IoT—a pervasive network of tiny connected devices embedded in the environment or in everyday objects.
Plug-in Replacement APDs Dramatically Boost the Performance of Optical Systems
Phlux Technology’s Aura Noiseless InGaAsSb APDs significantly enhance performance in optical ranging, imaging, and communication systems.
https://www.eejournal.com/article/111244/
The Wizard of Oz and Mozart Meet Generative and Agentic AI
I’ve barely managed to wrap my mind around the concept of Generative AI, only to find that the current buzz on the street is increasingly turning to the topic of Agentic AI.
https://www.eejournal.com/article/the-wizard-of-oz-mozart-genai-and-agentic-ai/
New FPGA Conference and Exhibition Coming to the UK and USA
With events scheduled in both the UK and the US, this bodacious beauty will focus solely on FPGA designers and developers. No executive daydreaming, corporate fairy dust, unicorn metrics, brochureware, or “marketing poetry”—just nitty-gritty engineering know-how.
Reinventing the Wheel… and the Motor… and the Powertrain
The HaloDrive from Orbis Electric offers high efficiency (up to 97% operational efficiency), high torque density (matching a V8, estimated at 100 Nm/kg or more), lower cost (up to 35% reduction in drivetrain cost over traditional radial-flux motors), and versatility (functions both as motor and, with minor winding changes, as a generator).
https://www.eejournal.com/article/reinventing-the-wheel-and-the-motor-and-the-powertrain/
Flash Memory with a Secure Twist
Macronix’s security suite of products–ArmorAuthen, ArmorBoot, ArmorFlash, and Armor Quantum–make the company a key player in enabling secure and reliable embedded systems.
https://www.eejournal.com/article/flash-memory-with-a-secure-twist/
Exceptional Multi-Mode Antennas for Your Inimitable Connected Devices
With eight sites spanning the globe, Taoglas does everything in-house, including all antenna design, prototyping, mechanical design, RF testing, assembly, and manufacturing.
Will New Ultra-High-Performance AI Inference Chips Make AI Data Centers Cost-Effective?
The Jotunn 8 from VSORA provides an eye-watering 3.2 petaflops of fully programmable processing power.
High-Precision Positioning in the World’s Deepest Mines and on the Moon
The FOGs used in Boreas IMUs from Advanced Navigation are so sensitive and accurate that they can detect the Earth’s rotation, which is 15 degrees per hour. Since they have an external reference point, they aren’t subject to drift!
21st Century Real-Time Navigation for the Visually Impaired
Eyesynth’s NIIRA glasses utilize RealSense depth-sensing technology to capture 3D spatial data, which is then processed to generate auditory cues for individuals who are visually impaired.
https://www.eejournal.com/article/21st-century-real-time-navigation-for-the-visually-impaired/
Hardware-Agnostic Sensitivity-Aware Fully-Automated AI Model Optimization is a Game-Changer
Featuring hardware-agnostic push-button automation, CLIKA supports both PTQ and QAT across model families (including generative and agentic). The differentiator is its ability to perform sensitivity-aware quantization (SAQ).
Meet the ManT1S: Computing, Comms, and Power Over Single Pair Ethernet
Silicognition’s ManT1S is an ESP32 board with 10BASE-T1S Single Pair Ethernet networking built in. It’s designed to allow daisy-chaining of multiple boards using just pairs of wires to form a network.
Migrating SWaP-C-Constrained Aerospace & Defense Apps to VNX+
VNX+ retains the small form factor (SFF) footprints of VNX but upgrades everything else: data rates up to 25+ Gbps (100 GbE), better thermal and power management, full SOSA alignment for plug-and-play sensor systems, and expanded I/O, including RF and optical interfaces.
https://www.eejournal.com/article/migrating-swap-c-constrained-aerospace-defense-apps-to-vnx/
FPGA-Based Prototyping Like You Wouldn’t Believe
One of the keys to Siemens’ Veloce proFPGA’s awesomeness is its magnificently modular architecture.
https://www.eejournal.com/article/fpga-based-prototyping-like-you-wouldnt-believe/
Smarter Human Machine Interfaces at the Edge
A smarter HMI won’t simply wait for a button to be pressed—it will interpret intent, learn patterns, and deliver feedback in ways that reduce friction and boost productivity.
https://www.eejournal.com/article/smarter-human-machine-interfaces-at-the-edge/
SiTime Has Unleashed its Titan MEMS Resonators (Be Afraid, Be Very Afraid)
At 0.46 x 0.46mm, the Titan occupies 7X less PCB real estate than a 1210-size quartz crystal. Additionally, it can be die-attached and wire-bonded, or bumped, like any standard silicon die inside the SiP.
New Auto Test Capability for the Analog Portions of SoCs
The combination of Siemens’ Tessent AnalogTest and Tessent DefectSim provides SoC verification engineers with the analog equivalent of ATPG, structural test, and fault coverage analysis.
https://www.eejournal.com/article/new-auto-test-capability-for-the-analog-portions-of-socs/
Are We Ready for 2Q 21C?
Say hello to next-generation AI-enabled apps at the edge, where the “internet rubber” meets the “real-world road.”
https://www.eejournal.com/article/are-we-ready-for-2q-21c/
Agentic AI Prevents Costly Machine Downtime in Factories and Semiconductor Fabs
Via Automation’s agentic AI platform addresses the problem of unplanned downtime in factories and semiconductor fabs, where the costs of such downtime exceed $1.5 trillion globally each year.
Edge AI Inferencing 5X Faster with 1/2 the Memory (What’s Not to Love?)
Ambiq’s introduced two new edge AI runtime flows, HeliaRT (a plug-in replacement for TFLM that runs 5X faster) and HeliaAOT (also 5X faster AND 1/2 the memory).
Bodacious Buzz on the Brain-Boggling Neuromorphic Brain Chip Battlefront
BrainChip’s Akida IP for SoCs employs a neuromorphic architecture based on spiking neural networks (SNNs), thereby providing always-on, real-time streaming Edge AI that runs continuously on milliwatts of power.
Polish Logic Meets Silicon Magic: Say Hi to Grinn’s GenioSOM-700
Featuring the MediaTek MT8390 processor (which is implemented at the 6um process node), the GenioSOM-700 punches above its weight in terms of raw computing power with the smallest form factor at an affordable price point.
https://www.eejournal.com/article/polish-logic-meets-silicon-magic-meet-grinns-geniosom-700/
Next-Gen Multimodal GenAI Processors for the AIoT Edge
The Astra SL2600 Series of multimodal Edge AI processors from Synaptics is purpose-built for the next wave of… well, everything, really.
https://www.eejournal.com/article/next-gen-multimodal-genai-processors-for-the-aiot-edge/
Is It Time to Bring PCB Assembly (PCBA) In-House?
DDM Novastar offers a full suite of equipment tailored for LTH and SMT board assembly, especially for prototyping and low- to medium-volume production.
https://www.eejournal.com/article/is-it-time-to-bring-pcb-assembly-pcba-in-house/
Inside the RISC-V Hardware Wars: A Streetfighter’s Unfiltered Take
In which we learn about the RISC-V crusade of maverick Yuning Liang (founder of DeepComputing) to reshape the chip industry—without permission, funding, or patience.
https://www.eejournal.com/article/inside-the-risc-v-hardware-wars-a-streetfighters-unfiltered-take/
Will ECS-DoT Be the Processor-of-Choice for Battery-Powered AI at the Edge?
In the case of Edge AI, compared with leading competitors, ECS-DoT operates up to 93% faster while consuming 90% less energy, all while supporting true multimodal sensor fusion on-device.
Model-Based Design Is Transforming System Development
“Fail quickly and fail often but fail virtually” is the essence of modern engineering. Don’t wait for the prototype to tell you what’s wrong. Let the model do it for you before you spend a cent on a real-world implementation.
https://www.eejournal.com/article/model-based-design-is-transforming-system-development/
From Code Chaos to Cyber Confidence: Inside the World of Firmware Obfuscation
Emproof’s passive protections conceal the intent—twisting binaries into deceptive, misleading forms that confound reverse-engineering tools and leave attackers scratching their heads. Their active defenses stand guard at runtime, detecting debuggers, spotting tampering, and refusing to cooperate when something looks suspicious.
Make It So: Agentic AI Comes to Flux
Tell Flux what you want to design, and it will deploy AI agents to design the circuit, generate the schematic, select the components, and lay out the PCB.
https://www.eejournal.com/article/make-it-so-agentic-ai-comes-to-flux/
Who Doesn’t Need Battery-Powered, Cloud-Free AI?
Ambient Scientific’s newly announced GPX10 Pro processor blurs the line between traditional microcontrollers and dedicated AI accelerators.
https://www.eejournal.com/article/who-doesnt-need-battery-powered-cloud-free-ai/
Micro-Miniature Ethernet Switches and Routers
BotBlox’s SwitchCore is an 8-port, 10/100 Mbps Ethernet switch AND router that measures just 1.0 x 1.0 x 0.5 inches.
https://www.eejournal.com/article/micro-miniature-ethernet-switches-and-routers/
Want Nano-Scale, CMOS-Based MEMS Sensors?
Nanusens’s sensors are 1,000 times smaller than their traditional silicon-based MEMS counterparts, offering greater bandwidth and higher sensitivity, while also being more cost-effective and reliable.
https://www.eejournal.com/article/want-nano-scale-cmos-based-mems-sensors/
Analog Neuromorphic Processors for ASICs/SoCs Offer Microwatt Edge AI
POLYN’s proprietary hardware and design tool ecosystem enables a trained digital neural network model to be translated into an analog neuromorphic core implemented in CMOS.
Do You Want To Be An AI Plumber?
The folks at Ainekko have launched AI Foundry–an open-source community that releases production-grade RTL, system emulators, software stacks, and developer tooling–and they are actively looking for AI Plumbers.
https://www.eejournal.com/article/do-you-want-to-be-an-ai-plumber/
AI at the Edge? Meet Wi-Fi in Microwatts
Using bi-static passive backscattering on Wi-Fi (or BLE), HaiLa can run a Wi-Fi-connected sensor with 5–10µW average, which is low enough to run a sensor for 15–20 years on a single CR2032 battery cell!
https://www.eejournal.com/article/ai-at-the-edge-meet-wi-fi-in-microwatts/
Meet the Power-Delivery Chiplets That May Save 50% of Your AI Power
Power-delivery chiplets from PowerLattice (each capable of handling 200A) are so small and thin that arrays of them can be mounted in the same package as the XPU (CPU, GPU, TPU, FPGA, ASIC…)
How to Stop Bad Actors Reverse Engineering Your ASICs/SoCs and FPGAs
From obfuscating FSMs, to reordering bits, scattering components, and inserting dummy flops, to using camouflage and covert logic gates, Emproof and the Max Planck Institute for Security and Privacy have your back.
Can You Hear Me Now (With My 21st Century Studio-Quality MEMS Microphone)?
sensiBel’s optical MEMS microphones can operate with a 250X stronger signal and have a 5X lower noise floor.
Meet the Next Generation of AR+AI Glasses User Interfaces
UltraSense supports multiple capacitive, ultrasonic, and force sensing channels with a tiny 1.5 x 3mm ASIC
https://www.eejournal.com/article/meet-the-next-generation-of-ar-glasses-user-interfaces/
GenSoC: Designing SoCs with Generative AI
New from XMOS, GenSoC isn’t about using AI on XCORE. It’s about using AI to unlock what XCORE has been able to do all along—deterministic, parallel, real-time systems—by finally giving engineers a way to talk to silicon in the language they already use to think.
https://www.eejournal.com/article/gensoc-designing-socs-with-generative-ai/
A Blob No More
SEGGER’s emApps turns embedded systems from monolithic firmware blobs into flexible, app-driven platforms—letting developers safely add, swap, and evolve features on deployed devices without reflashing, destabilizing cores, or blowing tight memory budgets.
https://www.eejournal.com/article/a-blob-no-more/
Resurrecting Dead Grandmothers (Again)
Resurrected grandmothers, VR zombies, and lonely people come together in a reflection on how immersive presence and physicality make virtual reality feel oddly—and powerfully—human.
https://www.eejournal.com/article/resurrecting-dead-grandmothers-again/
A 4-Bit CPU For the 21st Century
4-bit processing never truly disappeared; it simply went underground. Dare we envisage a new 4-bit architecture for the 21st Century?
https://www.eejournal.com/article/a-4-bit-cpu-for-the-21st-century/
Efficient Computer’s Efficient Computer is 100X More Energy-Efficient than Other General-Purpose Processors
Is 99% of your energy going into NOT performing computation? The Electron E1 uses a spatial dataflow Fabric to run real-world workloads (involving a mix of DSP, control, and AI) with up to 100X the energy efficiency of conventional processors.
Monetizing Stranded Megawatts in AI Data Centers
Hammerhead AI is a software platform that unlocks underutilized power capacity inside data centers by dynamically orchestrating delay-tolerant AI workloads, turning otherwise idle watts into lower-cost, revenue-generating compute without violating existing SLAs.
https://www.eejournal.com/article/monetizing-stranded-megawatts-in-ai-data-centers/
How Optical Switches Can Cut AI Hyperscale Data Center Power by 40%
Omnitron Sensors has overcome the stability, scalability, and manufacturability limits of today’s optical circuit switches.
Making Materials Smart with Nanoscale Sensors
Digid is redefining sensing with its patented nanoscale force and temperature sensors—micron-scale devices printed directly onto tools and materials to enable ultra-fast, EMI-immune measurement where conventional sensors simply can’t go.
https://www.eejournal.com/article/making-materials-smart-with-nanoscale-sensors/
Want to Invest in Humanoid Robots (Or Have Your Humanoid Robots Invested In)?
Humanoid Global is a publicly traded investment firm uniquely focused on accelerating the rise of humanoid robots by investing across the entire embodied-AI ecosystem, from platforms to enabling technologies.
AI-Powered PCB Layout Tool Delivers a Working SBC
Quilter.ai’s AI-powered PCB layout tool has automatically produced a complete, working single-board computer (SBC). Offloading the time-consuming placement and routing tasks from a human-provided schematic, and dramatically speeding hardware design while still booting and operating just like a traditionally designed board.
https://www.eejournal.com/article/ai-powered-pcb-layout-tool-delivers-a-working-sbc/
This Is Going to Be the Best FPGA Conference in the USA Ever! (Said Max, Excitedly)
The FPGA Horizons US East 2026 Conference & Exhibition promises outstanding speakers, practical FPGA insights, and an energizing community of designers and innovators. If you care about where FPGA technology is headed — and want to be part of that conversation — this is a must-attend event.
Agentic AI Framework for Edge Applications
NXP’s new eIQ Agentic AI Framework extends edge-AI beyond perception and generative capabilities by orchestrating multiple AI models and actions entirely on-device, empowering real-world systems to sense, decide, and act autonomously with elegance and practicality.
https://www.eejournal.com/article/agentic-ai-framework-for-edge-applications/
Chiplets Get Physical: The Days of Mix-and-Match Silicon Draw Nigh
Cadence is pushing chiplet technology forward with its Physical AI Chiplet Platform and ecosystem to help bridge today’s multi-die designs toward an open, interoperable future of scalable, mix-and-match silicon systems.
https://www.eejournal.com/article/chiplets-get-physical-the-days-of-mix-and-match-silicon-draw-nigh/
Beyond the Spherical Chicken: Rewriting Maxwell for Modern Machines
Nullspace EM is a modern full-wave 3D solver that preserves full accuracy while running dramatically faster and enabling AI-driven design workflows.
Dipping Our Toes Deeper into the AI+AR Computing Waters
Swave Photonics’ groundbreaking nano-pixel holographic display technology is creating wonderfully realistic, lightweight AI+AR smart glasses that could usher in a new era of immersive spatial computing.
https://www.eejournal.com/article/dipping-our-toes-deeper-into-the-aiar-computing-waters/
I Doff My Cap to the New Hailo RPi AI HAT+ 2
A game-changing Raspberry Pi add-on that unleashes local generative AI and vision-model horsepower with 40 TOPS of neural compute and 8 GB of dedicated memory, letting you run LLMs and advanced AI right on your Pi without the cloud.
https://www.eejournal.com/article/i-doff-my-cap-to-the-new-hailo-rpi-ai-hat-2/
Physical AI at Foundry Scale
The convergence of MIPS’ RISC-V-based Physical AI vision with GlobalFoundries’ foundry-scale integration is creating an exciting new industrial pathway for real-world AI that can sense, think, act, and communicate at the edge, where the “internet rubber” meets the “real-world road.”
https://www.eejournal.com/article/physical-ai-at-foundry-scale/
Powering Kilowatt-Plus Processors
Ferric Corporation’s new integrated voltage-regulator (IVR) chiplets deliver exceptionally high-density power right under (or inside) kilowatt-plus AI and HPC processors, dramatically improving power delivery efficiency and performance for next-generation compute platforms.
https://www.eejournal.com/article/powering-kilowatt-plus-processors/
Well, Fork Me with a Dining Philosophers Problem (or The Best Way to Debug Embedded Systems)
Percepio’s Detect quietly watches your embedded system and springs into action when something misbehaves, preserving just enough trace and crash context to tell you exactly who grabbed which fork.
Mad Max Meets Furiosa AI
FuriosaAI’s renegade RNGD chip upends the AI inferencing game. The company’s tensor-native architecture provides cost-and-power-efficient performance that challenges conventional GPUs.
https://www.eejournal.com/article/mad-max-meets-furiosa-ai/
Bumblebees Can’t Fly, and Humans Can’t Exist (I have Proof)
If bumblebees supposedly can’t fly, then modern biology suggests something even stranger—humans probably shouldn’t exist either.
https://www.eejournal.com/article/bumblebees-cant-fly-and-humans-cant-exist-i-have-proof/
The Curious Case of the Waning Wheeltapper
With its CV7 edge-AI vision SoC and the new Ambarella DevZone, the company is giving developers the tools—and agentic AI frameworks—needed to build smarter, more autonomous edge systems.
https://www.eejournal.com/article/the-curious-case-of-the-waning-wheeltapper/
Three Companies, One Toolchain: The Rise of TASKING 3.0
The unification of TASKING, iSYSTEM, and LDRA has resulted in a new end-to-end toolchain that spans compilation, debugging, and verification for safety-critical embedded systems.
https://www.eejournal.com/article/three-companies-one-toolchain-the-rise-of-tasking-3-0/
When AI Comes Home to Roost
The Synaptics’ SYN765x Wi-Fi 7 AI-native connected MCU is a jaw-droppingly awesome single-chip powerhouse that fuses blazing-fast connectivity with on-device intelligence to redefine what edge IoT devices can do.
Verification Engineers Are Poised to Become Verification Scientists
Siemens’s Questa One Agentic Toolkit and Fuse EDA AI framework combine to deliver brilliantly powerful, agentic-AI-driven verification workflows that automate and accelerate IC design tasks—transforming engineers into “verification scientists” while dramatically boosting productivity, insight, and design quality.
FPGAs Beating GPUs at LLM Inference: Say What?!?
ElastixAI’s reconfigurable FPGA-based LLM inference technology is a jaw-droppingly efficient alternative to GPUs, dynamically adapting hardware to each model to deliver dramatically better performance, utilization, and power efficiency.
https://www.eejournal.com/article/fpgas-beating-gpus-at-llm-inference-say-what/
When AI Meets Multi-Die (and Neither Lets Go)
Synopsys showcases how AI and chiplet-based multi-die technology are locked in a virtuous cycle—each driving the other to deliver unprecedented performance, scalability, and design innovation for next-generation systems.
https://www.eejournal.com/article/when-ai-meets-multi-die-and-neither-lets-go/
High-Performance Ultra-Low-Power AI MCUs Running at Only 0.3V (Eeek!)
Ambiq’s Atomiq redefines ultra-low-power edge AI, combining clever architecture and SPOT technology to deliver real performance at a jaw-dropping 0.3V.
https://www.eejournal.com/article/high-performance-ultra-low-power-mcus-running-at-only-0-3v-eeek/
The Day “No Signal” Died: 5G Meets Satellites
PentaG-NTN from CEVA underscores the increasing viability of integrated 5G terrestrial and non-terrestrial connectivity.
https://www.eejournal.com/article/the-day-no-signal-died-5g-meets-satellites/
Sustainable Power for an Increasingly Intelligent World
Ligna Energy’s lignin (wood)-based supercapacitor technology provides a wonderfully sustainable, fast-charging alternative that could transform how we power the next generation of intelligent devices.
https://www.eejournal.com/article/sustainable-power-for-an-increasingly-intelligent-world/
Meet the AI That Doesn’t Just Hear What You Say—It Hears What You Mean!
With Velma, Modulate delivers brilliantly nuanced conversational voice AI that hears emotion, intent, and meaning—not just words.
Meet the Embedder AI Firmware Engineer
Embedder’s agentic AI Firmware Engineer closes the loop with fully automated verification—testing and debugging its auto-generated code on target silicon.
https://www.eejournal.com/article/meet-the-embedder-ai-firmware-engineer/
EnCharge Me Up! 200 AI TOPS at Only ~8 Watts
EnCharge’s EN100 brings powerful local AI inference to laptops, workstations, and beyond—without melting your desk.
https://www.eejournal.com/article/encharge-me-up-200-ai-tops-at-only-8-watts/
TrustInSoft Analyzer Turbocharged with AI and RUST
TrustInSoft Analyzer blends AI and formal methods to deliver provably correct C, C++, and Rust code.
https://www.eejournal.com/article/trustinsoft-analyzer-turbocharged-with-ai-and-rust/
Want to Build Chips 10X faster and at 50% Lower Cost (Without Changing Existing Tools or Workflows)?
Moores Lab AI does the work no one wants to do (automating PSS model creation) while Breker does the work everyone needs done (delivering battle-tested system-level verification at scale).
Should We Terraform Mars (“Yay” or “Nay”)?
From lifeless red desert to blue oasis—should humanity remake Mars, or should we leave the Red Planet gloriously alone?
https://www.eejournal.com/article/should-we-terraform-mars-yay-or-nay/
Physical AI Robotic Ships on Patrol!
What if we made the oceans as observable, autonomous, and intelligently managed as modern airspace? The folks at Mirai Robotics aim to do just that!
https://www.eejournal.com/article/physical-ai-robotic-ships-on-patrol/
Want Physical AI? Just Add Water!
NXP Semiconductors’ i.MX 93W collapses complexity, making physical AI a ‘Just Add Water’ reality.
https://www.eejournal.com/article/want-physical-ai-just-add-water/
Robots That Learn Through Interaction and Understand Objects Intuitively
Have we been thinking about machine vision all wrong? CynLr’s Object Intelligence reimagines vision as an active process instead of passive image recognition.
AI Data Centers in Space: Bonkers or Visionary?
Orbital’s Euwyn Poon proposes solar-powered AI data centers in space—and the more you think about it, the less crazy it sounds.
https://www.eejournal.com/article/ai-data-centers-in-space-bonkers-or-visionary/
AI+AR Glasses That Remember Where You Left Your Keys
With its open-source Halo, Brilliant Labs may finally have created AI+AR glasses that feel less like science fiction and more like everyday reality.
https://www.eejournal.com/article/aiar-glasses-that-remember-where-you-left-your-keys/
Finally, a 100% Semiconductor FMCW LiDAR That Truly Is 100% Semiconductor!
Voyant Photonics’ Helium brings fully integrated FMCW LiDAR onto a single semiconductor chip, promising a smaller, cheaper, and more capable future for machine perception.
Have We Been Doing Edge AI the Hard Way All Along?
Literal Labs challenges neural-network orthodoxy with logic-based AI that delivers 50x faster inference while using just 1/50th the energy.
https://www.eejournal.com/article/have-we-been-doing-edge-ai-the-hard-way-all-along/
You Say “Ultra-Low-Power Connected Edge AI,” I Say “Nordic Semiconductor”
The nRF54LM20B and Nordic’s homegrown Axon NPU bring practical AI to the connected edge.
This Circuit Board Can Rewire Itself
Itera’s liquid-metal architecture enables real-time hardware iteration and debugging.
https://www.eejournal.com/article/this-circuit-board-can-rewire-itself/
Everything You Wanted to Know About AI (But Were Too Afraid to Ask)
A whirlwind tour of the concepts, architectures, hardware, and hype powering today’s AI revolution.
https://www.eejournal.com/article/everything-you-wanted-to-know-about-ai-but-were-too-afraid-to-ask/
A Little AI Glossary for Your Edification and Delight
Whether you’re reading about AI, writing about AI, or simply trying to make sense of the terminology, this glossary provides concise, plain-English explanations of many of the terms you’ll encounter along the way.
https://www.eejournal.com/article/a-little-ai-glossary-for-your-edification-and-delight/
Reinventing the Embedded Firmware Ecosystem (Again)!
BootLoop’s AI-powered Test platform promises to bring enterprise-grade hardware-in-the-loop testing to every embedded team.
https://www.eejournal.com/article/reinventing-the-embedded-firmware-ecosystem-again/
Migrating State-of-the-Art Active Cooling from Data Centers into Our Pockets
Boréas Technologies’ microfluidic cooling solution is bringing data-center-class thermal management to the next generation of mobile devices.
Giving Physical AI Systems Better Hearing
From synthetic soundscapes to the FFASR Leaderboard, Treble Technologies is advancing the way Physical AI systems learn to listen.
https://www.eejournal.com/article/giving-physical-ai-systems-better-hearing/
Addressing the Disconnect Between AI Speed and Wet Lab Reality
By combining AI, XR, and robotics, LabOS and MedOS promise to bring AI out of the computer and into the physical world, accelerating everything from laboratory research to clinical care.
https://www.eejournal.com/article/addressing-the-disconnect-between-ai-speed-and-wet-lab-reality/
Is it a Bird? Is it a Drone? Neuromorphic Edge AI Knows
BrainChip’s Akida neuromorphic AI platform brings human-brain-inspired intelligence to edge devices, enabling extraordinary classification capabilities with minimal power consumption.
https://www.eejournal.com/article/is-it-a-bird-is-it-a-drone-neuromorphic-edge-ai-knows/
Space Isn’t What It Used to Be: The Final Frontier Has Gone Commercial
As cheaper launches and smarter satellites reshape the economics of space, Microchip has positioned itself for a very different kind of Space Age.
English Is the New C++: Building Physical AI in Hours, Not Months
With its Palette SDK now augmented by Palette Neat Agentic AI, SiMa.ai is transforming physical AI development, replacing months of low-level coding with high-level intent expressed in everyday English.
https://www.eejournal.com/article/english-is-the-new-c-building-physical-ai-in-hours-not-months/
Are Modulated Ultrasound MEMS Speakers the Future of Speakers?
With its groundbreaking modulated-ultrasound MEMS speakers, SonicEdge is redefining what tiny loudspeakers can achieve.
https://www.eejournal.com/article/are-modulated-ultrasound-mems-speakers-the-future-of-speakers/
The Dawn of Agentic AI Super-Agents
Cadence isn’t trying to replace forty years of EDA with AI. It’s teaching AI how to use forty years of EDA.
https://www.eejournal.com/article/the-dawn-of-agentic-ai-super-agents/
We’re One Step Closer to Drag-and-Drop Off-the-Shelf Chiplet-Based Design
Zero ASIC’s long-term vision is to reduce multi-die system design—from system concept to manufacturable silicon—to little more than selecting your chiplets, pressing “Compile,” and waiting for the foundry to deliver the finished device.
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